Ø 8 and 12 inch wafers, compatible with the same equipment

Ø Compatible with high warpage wafers, ± 5mm

Ø Oxygen content control ≤ 20ppm or ≤100ppm

Ø 52 wafers can be processed at the same time

Ø It can correspond to 13/25 layers of FOUP at the same time, and the UI will be automatically switched

Ø The software is equipped with the function of repeated feeding, and more than 12 magazines can be loaded and recorded in a single cavity

Ø Convex door design of pressure oven: good heat insulation, light weight, strong pressure resistance, and safety and security with incisors

Ø Each chamber is certified by the Pressure Vessel Association and has an independent certificate

Ø Circulating motor, its own heat dissipation design, no need for additional cooling into the cavity, no risk of water leakage

Ø Special exhaust gas collection and filtration system can effectively inhibit the deposition pollution in the furnace and prolong the service life of the equipment

Ø Cavity overpressure protection design, three-stage independent pressure control exhaust, automatic pressure switch protection and mechanical safety valve protection

Ø Temperature range: RT~200 / 300°C

Ø 2 cavities can be set with different process conditions and operate at the same time

Ø The formula and various functional parameters are collected and uploaded, which meets the requirements of semiconductor SECS/GEM and EAP operations

Ø Vacuum system can be selected to enhance the ability to remove large bubbles

Ø AGV/OHT system can be selected

Ø ASME certification, SEMI S2 & S8 or CE, third-party certification is optional