1. 8-inch and 12 inch wafers, compatible with the same equipment for operation

2. Can correspond to high curvature wafers, ± 5mm

3. Temperature range RT~200 ℃

4. Chamber cleanliness>Class 100

5. Oxygen content control ≤ 20ppm

6. Can process 104 wafers simultaneously

7. Four chambers can be set with different process conditions and operate simultaneously

8. Can simultaneously correspond to 13/25 layers of FOUP, with automatic UI switching

9. The equipment occupies a small area and consumes less energy in the clean room, resulting in low CoO production costs

10. The software is equipped with a repeated feeding function, and a single chamber can load and record more than 12 material boxes

11. The formula and various functional parameters are collected and uploaded to meet the requirements of semiconductor SECS/GEM and EAP operations

12. Optional RT~450 ℃ temperature range

13. Optional AGV/OHT system can completely replace traditional ovens and save time in two slicing processes

14. Optional SEMI S2&S8 or CE, third-party certification