DAION CHINA
Double furnace vacuum pressure oven
NPPS-DWDOA-65
This series can be widely used in the back-end (BEOL) wafers of advanced integrated circuit manufacturing, removing bubbles or gases trapped in the bottom filling or packaging processes of various materials (such as thin films) during the lamination process, thereby enhancing adhesive strength and reliability.

Phone:

0512-65162969

Main features
主要特点

1. Convex door design: Good heat insulation effect, light weight, strong pressure resistance, and safe and secure combination with door teeth

2. Each chamber is certified by the Pressure Vessel Association and has an independent certificate of conformity

3. Circulating motor, with its own heat dissipation design, does not require additional water cooling to enter the cavity, and there is no risk of water leakage

4. Special exhaust gas collection and filtration system effectively suppresses sedimentation pollution in the furnace, which can extend the service life of the equipment

5. Design for chamber overpressure protection, three-stage independent pressure control exhaust, automatic pressure switch protection, and mechanical safety valve protection

6. Temperature range RT~200/300/400 ℃

7. Two chambers can be set with different process conditions and operate simultaneously

8. The formula and various functional parameters are collected and uploaded, meeting the requirements of semiconductor SECS/GEM and EAP operations

9. Optional vacuum system to enhance the ability to remove large bubbles

10. Optional ASME certification

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