Phone：
0512-65162969
1. Standard 4 or 8 cleaning chamber configuration, multi chamber high production capacity, both can independently set parameters
2. 8 and 12 inch wafers, compatible with the same equipment for operation
3. Each cleaning chamber is equipped with an independent FFU for speed adjustment and differential pressure monitoring
4. The appearance of wafer cleaning should not have water stains, spots, scratches, color differences, or residues (≥ 50nm)
5. Raise the temperature of the medicine from room temperature to 65 ℃ (Max.), and maintain the temperature at ± 1.5 ℃
6. The uniformity of wafer etching is ≤ 10%.
7. The equipment occupies a small area and consumes less energy in the clean room, resulting in low CoO production costs
8. Space planning for water and gas piping for easy maintenance and upkeep
9. The process, formula, and various functional parameters of the cavity are collected and uploaded to meet the requirements of semiconductor SECS/GEM and EAP operations
10. Optional SEMI S2&S8, third-party certification
