1. 8-inch and 12 inch wafers, compatible with the same equipment for operation

2. Can correspond to high curvature wafers, ± 5mm

3. Can correspond to various FOUPs FOSB、Insert FOUP、Open Cassette、Metal Cassette

4. The equipment occupies a small area and consumes less energy in the clean room, resulting in low CoO production costs

5. The formula and various functional parameters are collected and uploaded to meet the requirements of semiconductor SECS/GEM and EAP operations

6. Equipped with wafer OCR 2D code reading function

7. Equipped with wafer edge scanning and alignment functions, it can correspond to 8-inch (Flat) and 12 inch (Notch)

8. Optional SEMI S2&S8 or CE, third-party certification